ASUS ROG STRIX LC II 280 ARGB - processor liquid cooling system

Article-No.:

228560

Manufacturer-No.:

90RC00C1-M0UAY1

EAN/GTIN:

4711081885641

WEEE Nummer

DE38765828

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Technical specifications

General

Product Type

Processor liquid cooling system

Packaged Quantity

Heatsink & Fan

Fans Qty

Fan Diameter

140 mm

Fan Height

25.5 mm

Rotation Speed

700-2100 rpm

Air Flow

102.3 cfm

Heatsink Dimensions

315 mm x 143 mm x 30 mm

Compatible With

LGA1200 Socket, LGA1700 Socket, Socket AM5, LGA115x Socket, Socket AM4, Socket TR4

Features

Rubber tubes(380 mm), ASUS Aura Sync, 7th Generation Asetek pump, Pulse-width modulation (PWM) support, Pre-applied thermal compound, Addressable RGB

Heatsink Material

Aluminum with copper base

Air Pressure

3.1 mm

Noise Level

35.7 dBA

Service & Support

Type

6-year warranty

Miscellaneous

Color Category

Black

RGB

Description

ROG Strix LC II 280 ARGB AIO delivers high-performance CPU liquid cooling with sleek, modern aesthetics. Featuring a closed-loop design and addressable RGB radiator fans, the cooler unleashes the full potential of an Intel or AMD CPU while further accentuating your build with brilliant multi-color lighting effects. With the cooling you expect from ROG, Strix LC II 280 ARGB is ready to become an essential part of your rig and light it up with your own unique style.

Emanate your style
Aura Sync support on the pump cover's illuminated ROG logo and addressable RGB radiator fans allows you to coordinate lighting effects with ROG build components - and show off your personal style. Also, engraved ROG lettering on the radiator's side complements the iridescent lettering on the hubs of each fan.
Optimized fan design
The ROG radiator fans are specifically tuned to deliver optimum performance on ROG Strix LC series radiators. The fans generate 102.3 cfm / 3.1 mmH2O for exceptional cooling efficiency.
Enhanced pump design
ROG Strix LC series is equipped with the latest cooling-plate design, which features micro-channels that provide greater surface area for thermal dissipation of CPU heat. This innovative feature reduces thermal resistance, delivering more efficient performance and cooler temperatures.