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Article-No.:
198632
Manufacturer-No.:
90MB1BL0-M0EAY0
EAN/GTIN:
4711081905660
WEEE Nummer
DE12375349
Technical specifications
Description
Technical specifications
General
Packaged Quantity
1
Processor
Installed Qty
0
Max Supported Qty
1
Mainboard
Form Factor
ATX
Compatible Processors
Ryzen
Chipset Type
AMD X670E
Supported RAM Technology
DDR5 SDRAM
Supported RAM Integrity Check
Non-ECC, ECC, On-die ECC
Supported RAM Speed
5400 MHz (O.C.), 5600 MHz (O.C.), 5800 MHz (O.C.), 6000 MHz (O.C.), 4800 MHz, 6200 MHz (O.C.), 6400 MHz (O.C.), 5200 MHz, 5000 MHz
Processor Socket
Socket AM5
Power Connectors
24-pin main power connector, 2 x 8-pin ATX12V connectors
Supported RAM (Registered or Buffered)
Unbuffered
RAM Slots
4 DIMM slots
Interfaces
Internal Interfaces
1 x USB-C 3.2 Gen 2 - header, 1 x audio - header, 1 x serial - header, 6 x USB 2.0 - header, 1 x Thunderbolt - header, 2 x USB 3.2 Gen 1 - header, 1 x SPI - header
RAM
Features
AMD EXPO technology, Dual channel memory architecture
Max Supported Size
192 GB
Video Output
Type
Graphics adapter (CPU required)
Audio Output
Type
Sound card
Compliant Standards
DTS:X Ultra, High Definition Audio
Audio Codec
Realtek ALCS1220A
Audio
High Definition Audio (8-channel)
Networking
Network
2.5 Gigabit Ethernet, Bluetooth 5.2, 802.11a/b/g/n/ac/ax (Wi-Fi 6E)
Expansion Slots
Expansion Slots
1 x CPU, 1 x PCIe 4.0 x4, 1 x M.2 socket (2242/2260/2280/22110 M.2 Key M slot), 1 x PCIe 5.0 x16, 3 x M.2 socket (2242/2260/2280 M.2 Key M slot), 4 x DIMM 288-pin, 1 x PCIe 4.0 x16 (x4 mode)
Interfaces
Storage Interfaces
PCIe 4.0 -connectors: 2 x M.2 - RAID 0 / RAID 1 / RAID 10, PCIe 5.0 -connectors: 1 x M.2 - RAID 0 / RAID 1 / RAID 10, SATA-600 / PCIe 3.0 -connectors: 1 x M.2 - RAID 0 / RAID 1 / RAID 10, SATA-600 -connectors: 4 x 7pin Serial ATA - RAID 0 / RAID 1 / RAID 10
Storage
Serial ATA-600 (RAID), M.2 socket
USB / FireWire
USB 3.2 Gen 1, USB 3.2 Gen 2, USB-C 3.2 Gen2, USB-C 3.2 Gen 2x2, USB-C 3.2 Gen 1
Storage Ports
4 x SATA-600 (RAID), 4 x M.2
USB / FireWire Ports Configuration (Active)
1 x USB-C 3.2 Gen 2x2 + 1 x USB-C 3.2 Gen 2 + 3 x USB 3.2 Gen 2 + 1 x USB-C 3.2 Gen 1 + 4 x USB 3.2 Gen 1
USB / FireWire Ports Configuration (Headers)
1 x USB-C 3.2 Gen 2 + 2 x USB 3.2 Gen 1 + 6 x USB 2.0
Software
Software Included
Norton AntiVirus (Trial), MyAsus, Armoury Crate, ASUS Fan Xpert 4, ASUS CPU-Z, ASUS AI Suite III, ASUS Turbo App, PC Cleaner, WinRAR
Dimensions & Weight
Width
30,5 cm
Depth
24,4 cm
Description
ASUS Prime series motherboards are expertly engineered to unleash the full potential of the AMD Ryzen 7000-series processors. Boasting a robust power design, comprehensive cooling solutions and intelligent tuning options, PRIME X670E-PRO WIFI provides users and PC DIY builders with a range of performance optimizations.
The ASUS PRIME X670E-PRO WIFI offers this all in a sleek, futuristic-looking package centered around a spaceship design aesthetic, with a silver-toned nameplate and chipset cover.
The ASUS PRIME X670E-PRO WIFI offers this all in a sleek, futuristic-looking package centered around a spaceship design aesthetic, with a silver-toned nameplate and chipset cover.
- 5-way optimization
ASUS 5-way optimization makes your PC smart. Along with taking care of complex tuning and dynamically optimizing essential aspects of your system, it offers intelligently simplified options for newcomers to PC DIY, as well as more comprehensive features for seasoned veterans. - Overclocking technologies
Whether you're looking to crush benchmarks or fine-tune your system for daily driving, PRIME offers unique tools that let you exploit the intricacies of the Ryzen architecture. - AI Cooling II
AI Cooling II balances the thermals and acoustics of any build with a single click. A proprietary ASUS algorithm slashes unnecessary noise while running a quick stress test, and then it monitors CPU temperatures to dynamically adjust fans to optimal speeds. - UEFI BIOS
The renowned ASUS UEFI BIOS provides everything you need to configure, tweak and tune your system. It offers intelligently simplified options for PC DIY beginners, as well as comprehensive features for seasoned veterans. - M.2 heatsink
Three M.2 heatsinks cover four M.2 slots, warding off throttling that can occur with M.2 storage during sustained transfers. - VRM heatsink and thermal pads
The two VRM heatsinks on PRIME X670E-PRO WIFI are significantly larger than those found on earlier X570 motherboards. Together with the thermal pads, they improve heat transfer from the MOSFETs and chokes for better cooling performance. - Cooler by design
PRIME X670E-PRO WIFI features comprehensive cooling controls. - Smart protection
A dedicated integrated circuit protects each fan header from overheating and overcurrent. - 4-pin PWM/DC fan
Each onboard header supports auto-detection of PWM or DC fans. - Robust power design
Stable power is essential to extract every last bit of performance out of AMD processors. The PRIME X670E-PRO WIFI is geared to cater to the demands of these high-core-count CPUs. - DDR5 performance enhancement
Comprehensive memory tuning options are the cornerstone of PRIME motherboards. With the PRIME X670E-PRO WIFI, you can extract all of the potential out of your DDR5 modules, whether they're from an extreme-speed kit or an entry-level set that would otherwise be locked. - ASUS OptiMem II
Revisions to the motherboard's trace routing provide the Intel processors with unrestricted access to memory bandwidth. ASUS OptiMem II technology carefully maps memory signal pathways across different PCB layers to reduce vias and adds shielding zones that significantly reduce crosstalk. - Four M.2 slots (with PCIe 5.0)
Four M.2 slots support up to the 22110 device and also can provide NVMe SSD RAID for incredible performance potential. Moreover, one M.2 slot supports PCIe 5.0 with data transfer speeds of up to 128 Gbps, enabling quicker operating system boot-up and file management. - PCIe 5.0 slot
PCIe 5.0 offers twice the data transfer speed of PCIe 4.0, making it robust enough to handle new data-heavy tasks. PCIe 5.0 also brings other benefits, such as electrical changes to improve signal integrity, backward-compatible CEM connectors for add-in cards, and compatibility with previous versions of PCI Express. - USB 3.2 Gen 2x2 Type-C
A batch of USB ports support high-end rigs loaded with peripherals, including a rear USB Type-C connector with ultrafast USB 3.2 Gen 2x2 for transmission speeds of up to 20 Gbps. - USB4 support
PRIME X670E-PRO WIFI motherboard features USB4 support via a Thunderbolt (USB4) header. Additionally, this card has a daisy-chain function for multi-screen connection and supports up to dual displays with 4K resolution. - Wi-Fi 6E
Built-in Wi-Fi 6E technology takes advantage of the newly available radio spectrum in the 6 GHz band. With triple the bandwidth of the 2.4/5/6 GHz band, Wi-Fi 6E delivers ultrafast wireless networking speeds with improved capacity and better performance in dense wireless environments. - Realtek 2.5 Gb Ethernet
Realtek 2.5 Gb Ethernet reduces CPU overhead and offers exceptionally high TCP and UDP throughput for faster, smoother data transfers. - Two-way AI noise cancelation
This utility leverages a massive deep-learning database to reduce background noise from the microphone and incoming audio, while preserving vocals at the same time. This removes distracting keyboard clatter, mouse clicks and other ambient noises so you can hear and be heard with crystal clarity while gaming or in calls. - Realtek codec and unique design features for pristine, powerful audio
The unique S1220A audio codec designed in close collaboration with Realtek provides pristine audio quality via an unprecedented 120 dB signal-to-noise (SNR) ratio for the stereo line out and a 113 dB SNR for the line in. An impedance-sensing circuit also adjusts gain for optimal headphone volume. DTS:X Ultra adds a spatial audio feature to boost headphones and speakers for enhanced gaming, VR and extended-reality experiences. DTS:X Ultra supports sound based on channels, scenes, and objects to allow for deeper sonic immersion in enabled content. It also provides post-processing enhancements and device-level tuning for DTS codecs.