ARCTIC TP-3 - thermal pad

ARCTIC TP-3 - thermal pad_1

Article-No.:

243989

Manufacturer-No.:

ACTPD00059A

EAN/GTIN:

4895213704021

Technical specifications

General

Product Type

Thermal pad

Packaged Quantity

2

Dimensions & Weight

Width

20 cm

Depth

10 cm

Thickness

1 mm

Dimensions & Weight (Shipping)

Shipping Width

22 cm

Shipping Depth

11,5 cm

Shipping Height

0,35 cm

Shipping Weight

161 g

Miscellaneous

Color

Blue

Features

55 Shore OO hardness, 7.6 kV/mm breakdown voltage

Color Category

Blue

Description

High performance - very soft
Based on silicone and a special filler, TP-3 outperforms high-performance pads, especially when height differences of closely spaced chips typically occur due to manufacturing tolerances. The TP-3 offers excellent thermal conductivity despite extremely low hardness.
Minimization of thermal resistance
The thinner the pad, the lower the thermal resistance. The TP-3 pad with a thickness of 0.5 mm can easily be compressed to 0.3 mm and thus compensate for height differences between various components of up to 0.2 mm. Please note that due to the extremely low hardness, the installation of the 0.5 mm pad requires extra care.
Versatile applications
Heat-conducting, vibration-damping, moldable, electrically insulating - safe and easy to use. Thanks to its good compression properties, the soft heat conduction pad is particularly gentle on components and at the same time a good heat conductor. In addition to the standard format for M.2, the TP-3 can be easily cut to the desired shape and size. This makes it ideal for RAMs, chipsets, and ICs of all kinds, which are used in PCs, laptops, consoles, graphics cards, and electronic devices in general.
Safe handling
The ARCTIC TP-3 is electrically insulating, non-adhesive, and easy to handle. This means that optimal and safe heat transfer can be ensured in many application areas.
Bridging gaps
The TP-3 is softer than conventional pads and therefore particularly suitable for different chip heights and possible tolerances. Thanks to their good compressibility properties, the thermal pads act as the perfect gap filler and bridge uneven surface and air gaps without stressing sensitive and protruding components.