Product content
Product content
- AORUS X670E PRO X
- External antenna
- Software
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Article-No.:
223468
Manufacturer-No.:
X670E AORUS PRO X
EAN/GTIN:
4719331859343
WEEE Nummer
DE74106091
Technical specifications
Description
Technical specifications
General
Packaged Quantity
1
Processor
Installed Qty
0
Max Supported Qty
1
Mainboard
Form Factor
ATX
Compatible Processors
Ryzen
Chipset Type
AMD X670
Supported RAM Technology
DDR5 SDRAM
Supported RAM Integrity Check
Non-ECC
Supported RAM Speed
5600 MHz (O.C.), 6000 MHz (O.C.), 4800 MHz, 6200 MHz (O.C.), 6400 MHz (O.C.), 6666 MHz (O.C.), 6600 MHz (O.C.), 7000 MHz (O.C.), 6800 MHz (O.C.), 4400 MHz, 7200 MHz (O.C.), 5200 MHz, 7600 MHz (O.C.), 7800 MHz (O.C.), 8000 MHz (O.C.)
Processor Socket
Socket AM5
Power Connectors
24-pin main power connector, 2 x 8-pin ATX12V connectors
Supported RAM (Registered or Buffered)
Unbuffered
RAM Slots
4 DIMM slots
Interfaces
Internal Interfaces
1 x Thunderbolt 4 - header, 1 x USB-C 3.2 Gen 2x2 - header, 1 x audio - header, 4 x USB 2.0 - header, 4 x USB 3.2 Gen 1 - header, 1 x SPI - header
RAM
Features
AMD EXPO technology, Intel Extreme Memory Profiles (XMP), Dual channel memory architecture
Max Supported Size
192 GB
Video Output
Type
Graphics adapter (CPU required)
Audio Output
Type
Sound card
Compliant Standards
High Definition Audio
Audio
High Definition Audio (7.1-channel)
Networking
Network
2.5 Gigabit Ethernet, Bluetooth 5.3, 802.11a/b/g/n/ac/ax/be (Wi-Fi 7)
Expansion Slots
Expansion Slots
1 x CPU, 1 x PCIe 5.0 x16, 2 x M.2 socket (2280/25110 M.2 Key M slot), 2 x M.2 socket (2280/22110 M.2 Key M slot), 4 x DIMM 288-pin, 1 x PCIe 3.0 x16 (x4 mode), 1 x PCIe 3.0 x16 (x2 mode)
Interfaces
Storage Interfaces
PCIe 4.0 -connectors: 2 x M.2 - RAID 0 / RAID 1 / RAID 10, PCIe 5.0 -connectors: 2 x M.2 - RAID 0 / RAID 1 / RAID 10, SATA-600 -connectors: 4 x 7pin Serial ATA - RAID 0 / RAID 1 / RAID 10
Storage
Serial ATA-600 (RAID), M.2 socket
USB / FireWire
USB 3.2 Gen 1, USB 3.2 Gen 2, USB-C 3.2 Gen 2x2
Storage Ports
4 x SATA-600 (RAID), 4 x M.2
USB / FireWire Ports Configuration (Active)
1 x USB-C 3.2 Gen 2x2 + 3 x USB 3.2 Gen 2 + 4 x USB 3.2 Gen 1 + 4 x USB 2.0
USB / FireWire Ports Configuration (Headers)
1 x USB-C 3.2 Gen 2x2 + 4 x USB 3.2 Gen 1 + 4 x USB 2.0
Software
Software Included
Norton Internet Security
Dimensions & Weight
Width
30,5 cm
Depth
24,4 cm
Description
The GIGABYTE AORUS X670E PRO X motherboard is a cornerstone for building a high-performance PC, catering to gamers and professionals alike. It brings together a suite of features, including DDR5 support with overclocking capabilities up to 8000 MHz, ensuring that memory speed supports your needs. High-speed connectivity is assured, with an array of USB-C 3.2 Gen 2x2, USB 3.2 Gen 2, and USB 3.2 Gen 1 ports, alongside robust networking options through 2.5 Gigabit Ethernet, Wi-Fi 7, and Bluetooth 5.3. The motherboard is built for durability and cooling, featuring an ultraslim design with 2x Copper PCB and advanced cooling solutions like M.2 Thermal Guard Ext. and Smart Fan 6 technology. Whether it's for gaming, content creation, or multitasking, the GIGABYTE AORUS X670E PRO X is engineered to meet high demands, providing a reliable and powerful platform for any task.
- High-speed connectivity
Equipped with USB-C 3.2 Gen 2x2, USB 3.2 Gen 2, and USB 3.2 Gen 1 ports, this motherboard offers a variety of options for high-speed connectivity and data transfer, ensuring compatibility with a wide range of devices. - Advanced cooling solutions
Features like M.2 Thermal Guard Ext. and Smart Fan 6 technology provide enhanced cooling for sustained performance, protecting critical components from overheating even under heavy loads. - Optimized for gaming
With support for DDR5 SDRAM at speeds up to 8000 MHz (O.C.), this motherboard is designed to handle the demands of high-end gaming, ensuring smooth and responsive gameplay. - Robust networking options
Incorporating 2.5 Gigabit Ethernet and Wi-Fi 7 (802.11a/b/g/n/ac/ax/be) with Bluetooth 5.3, it offers versatile and fast networking options, catering to both wired and wireless connectivity needs. - Enhanced durability
The ultraslim design, featuring 2x Copper PCB and Premium Power Choke, ensures long-term reliability and stability, making it a solid foundation for any high-performance PC build.