Gigabyte Mainboard B760M DS3H AX - Micro ATX - Socket LGA1700 - Intel B760

Article-No.:
209794
Manufacturer-No.:
B760M DS3H AX
EAN/GTIN:
4719331851767
WEEE Nummer
DE74106091
Technical specifications

General

Packaged Quantity
1

Processor

Installed Qty
0
Max Supported Qty
1

Mainboard

Form Factor
Micro ATX
Chipset Type
Intel B760
Supported RAM Technology
DDR5 SDRAM
Supported RAM Integrity Check
Non-ECC, ECC (operate in non-ECC mode)
Supported RAM Speed
5800 MHz (O.C.), 6000 MHz (O.C.), 4800 MHz, 6200 MHz (O.C.), 6400 MHz (O.C.), 6600 MHz (O.C.), 7000 MHz (O.C.), 6800 MHz (O.C.), 7200 MHz (O.C.), 5200 MHz, 5000 MHz, 5600 MHz, 5400 MHz
Processor Socket
LGA1700 Socket
Power Connectors
24-pin main power connector, 8-pin ATX12V connector
RAM Slots
4 DIMM slots

Interfaces

Internal Interfaces
1 x audio - header, 4 x USB 2.0 - header, 1 x SPDIF out - header, 2 x USB 3.2 Gen 1 - header, 1 x SPI - header

RAM

Features
Intel Extreme Memory Profiles (XMP), Dual channel memory architecture, Supported ECC modules operate in non-ECC mode
Max Supported Size
192 GB

Video Output

Type
Graphics adapter (CPU required)

Audio Output

Type
Sound card
Compliant Standards
High Definition Audio
Audio
High Definition Audio (8-channel)

Networking

Network
2.5 Gigabit Ethernet, 802.11a/b/g/n/ac/ax (Wi-Fi 6E), Bluetooth

Expansion Slots

Expansion Slots
1 x CPU, 2 x M.2 socket (2280 M.2 Key M slot), 4 x DIMM 288-pin, 2 x PCIe 3.0 x1, 1 x PCIe 4.0 x16

Interfaces

Storage Interfaces
PCIe 4.0 -connectors: 2 x M.2, SATA-600 -connectors: 4 x 7pin Serial ATA
Storage
Serial ATA-600 (RAID), M.2 socket
USB / FireWire
USB 3.2 Gen 1, USB-C 3.2 Gen2
Storage Ports
4 x SATA-600 (RAID), 2 x M.2
USB / FireWire Ports Configuration (Active)
1 x USB-C 3.2 Gen 2 + 3 x USB 3.2 Gen 1 + 2 x USB 2.0
USB / FireWire Ports Configuration (Headers)
2 x USB 3.2 Gen 1 + 4 x USB 2.0

Software

Software Included
Norton Internet Security

Dimensions & Weight

Width
24,4 cm
Depth
24,4 cm
Description
Gigabyte B760 motherboards are ready to work with the PCIe 4.0 devices which are expected to experience triple bandwidth than the current PCIe 3.0 devices. To reach the high speed and maintain good signal integrity, Gigabyte R&D; uses the low impedance PCB to provide the maximum performance.
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  • Q-Flash Plus
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